LEAD FRAME, SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF

摘要

PROBLEM TO BE SOLVED: To enhance moldability of LOC. SOLUTION: The lead frame has two bus bar leads 2a for power supply or ground each provided with a plurality of protrusions 2e projecting oppositely to the inner lead 2b thereof. A semiconductor chip 1 is buried and sealed in a package body 3 of epoxy resin molded by transfer molding along with the plurality of inner leads 2b. Furthermore, outer leads 2c projecting from the package body 3 is bent into gull-wing shape.