| 摘要 |
PROBLEM TO BE SOLVED: To provide an IC package where interconnection density can be improved. SOLUTION: A storage chip IC package has edge connectors 31 and 32, which extend to a base from the upper face of PWB14 along the edge and the sidewall of a cavity 15 for storing an IC chip 11, which is installed in a printed circuit board (PWB) 14. The edge connectors 31 and 32 operate as interconnection parts, instead of through-hole interconnection parts, and they improve mutual connection density. When the edge connectors 31 and 32 are used as interconnection parts for power and interconnection parts for ground, a signal I/O pad and a signal runner are insulated effectively. |
