| 摘要 |
<p>PROBLEM TO BE SOLVED: To directly arrange metal wires or metal plate materials of small resistance on a substrate with a narrow pitch. SOLUTION: After bringing a first adhesive material arranged on the surface of the substrate 1 in plural lines into contact with the metal wire pulled out in a positioned state as it is, it is heated and set while keeping contact with the metal wire in the positioned state, the metal wire is adhered to the substrate surface and a first metal electrode 10 is formed. Also, after bringing a second adhesive material provided with an insulation property arranged in the plural lines in a direction orthogonal to the first metal electrode 10 so as to cover the first metal electrode 10 into contact with the metal wire pulled out in the positioned state as it is, it is heated and set while keeping contact with the metal wire in the positioned state, the metal wire is adhered to the substrate surface and a second metal electrode 11 is formed.</p> |
