TRANSFER MOLDING APPARATUS AND PRODUCTION OF SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a transfer molding apparatus and a production method of semiconductor device in which void is not left in resin filling a cavity. SOLUTION: A position sensor 14 detects the position of a plunger 12 at the time of starting introduction of resin 28 into a cavity 20 and at the time when viscosity of the resin 28 filling the cavity 20 decreases and the pressure being applied to a bubble 29 in the resin 28 is lowered. A pressure control section 40 controls driving state of a suction pump 24 based on the detection results and regulates pressure in the cavity 20 to decrease difference between the pressure being applied to the bubble in the resin 28 and the pressure in the cavity.