| 摘要 |
PROBLEM TO BE SOLVED: To protect a die against damage by eliminating misalignment, turn- over and mixing different of IC package in setting an IC package in an IC lead bending die comprising upper and lower dies. SOLUTION: A lower die 3 is provided with an opening 7 shaped to fit the backside of an IC package 1 and an evacuation hole 16 is made in the upper surface of an ejector 4 for a knockout made in the opening 7. The evacuation hole 16 is coupled with a vacuum tube 17 and fixed with a digital vacuum switch 19. Degree of vacuum in the vacuum tube 17 is then detected in order to determine whether the upper surface of the ejector 4 is brought into tight contact with the backside of the IC package 1 set in the opening 7 of the die 3. If a decision is made that the IC package 1 is shifted from the die 3, lowering operation of the upper die is stopped.
|
