MANUFACTURE OF ELECTRONIC PART AND CIRCUIT MODULE, FORMATION OF BUMP AND FLATTENED CHUCK

摘要

PROBLEM TO BE SOLVED: To form a highly reliable bump for connecting an electronic circuit part easily and inexpensively using a conductive perform. SOLUTION: A first flux layer 7 is formed on the surface of a contact pad 5 and a solder ball 2 is mounted thereon and bonded temporarily through adhesion of the first flux. A second flux layer 8 boiling at a temperature lower than the melting point of the solder ball 2 is then formed on the surface of the solder ball 2 and the contact pad is bonded thermally to a conductive perform thus forming a bump 3.