| 摘要 |
PROBLEM TO BE SOLVED: To provide a non-contact IC card being a final product in a smooth state without any distortion even when the shape of an IC module included in a card substrate has a projection or recession or distortion. SOLUTION: An IC module 2, in which a coil for transmitting and receiving data and for receiving the supply of a power and an IC circuit inside the coil are arranged, has a diameter which is about 30 mm for a card substrate which is about 54 mm×85.5 mm, and this IC module 2 occupies a large area. Therefore, the IC module 2, in which the coil for transmitting and reception data and For receiving the supply of a power and the IC circuit inside the coil are arranged, is arranged in a cavity whose diameter is about 34 mm which is formed on the card substrate 3, and integrated by coating resin, and oversheet layers are laminated on the both faces of the card substrate 3 so as to be integrally constituted. |
