| 摘要 |
PROBLEM TO BE SOLVED: To enhance high volume productivity of solid state image sensor. SOLUTION: A stage 27 having a recess or a protrusion corresponding, in shape, to a CCD image sensor 1 is formed and applied with a glass plate 26 of same shape as the stage through a UV-curing adhesive 25. Consequently, the glass plate 26 is settled at a position being matched with the stage 27 by surface tension of the adhesive 25. Mixing of bubble or contamination is then checked before curing the adhesive 25 by irradiating with UV-rays. |
