| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for forming solder bumps in which solder bumps are projected sufficiently above a plate member without causing any damage on the plate member by preventing the solder from being left on the surface of the plate member while adhering thereto at the time of forming solder bumps using a plate member having a plurality of recesses. SOLUTION: A plate member 10 having a plurality of recesses 14 in the planar surface is applied with a mask 12 having a plurality of through holes 16 at the positions corresponding to the plurality of recesses 14 while arranging the through holes 16 and the plurality of recesses 14. The through holes 16 and the plurality of recesses 14 are then filled with solder paste 18 from above the mask 12. Subsequently, the mask 12 is removed from the plate member 10 and metal balls 22 are formed in the recesses by heating the plate member 10 and transferred to the electrodes 26 of an electronic part 24.
|
