发明名称 Verfahren zum Messen der Temperatur eines Leistungshalbleiters und Bauelement
摘要 <p>The invention relates to a method for measuring the operating temperature of a power semiconductor (1) comprising at least one barrier zone with a high operating temperature, whereby a high reaction rate can be obtained. It also relates to a component with a power semiconductor (1) comprising at least one barrier zone with a high operating temperature. In order to determine reliably and rapidly the operating temperature of said power semiconductor, said temperature is measured directly on the barrier zone of said power semiconductor (1) with a high operating temperature. For that purpose, a thermosensitive element (2, 6) is placed directly on the barrier zone with a high operating temperature.</p>
申请公布号 DE19835453(A1) 申请公布日期 2000.02.17
申请号 DE1998135453 申请日期 1998.08.05
申请人 SIEMENS AG 发明人 MAUDER, ANTON;FELDVOS, MARIO
分类号 G01K7/01;H01L23/34;H01L25/16;(IPC1-7):H01L23/62 主分类号 G01K7/01
代理机构 代理人
主权项
地址