Semiconductor switching installation with integrated current bus has bottom side mechanically connected to heat dissipation device

摘要

The switching installation forms a system for control of motors, or AC generators and comprises a high velocity switch with top part and bottom, in which is integrated a current bus with top and bottom surface. To the bottom surface of the bus a heat dissipation device is mechanically connected. The current bus contains a capacitor reversely arranged on its surface. The heat dissipation device comprises a top and bottom plate divided by a cooling duct. One inner face comprises a cooling fin. The current bus is ultrasonically welded to a contact of the switch.