发明名称 |
Metallisiertes Keramiksubstrat mit glatter Plattierungsschicht und Herstellungsverfahren |
摘要 |
A metallized ceramic substrate having a smooth plating layer, comprising a ceramic substrate comprising aluminum nitride as a main component; a tungsten- and/or molybdenum-based metallized layer formed on at least one face of the ceramic substrate and a nickel-based plating layer which is formed on the metallized layer and has a thickness of not greater than 2 mu m and a surface roughness (Ra) of not greater than 2 mu m. In another aspect, the plating layer may be constituted of a first nickel-based plating layer and a second gold-based plating layer in which the first plating layer and the second plating layer have a thickness of not greater than 2 mu m and a thickness of not greater than 1 mu m, respectively, and the surface roughness (Ra) of the second layer should be 2 mu m or less. These metallized substrates are produced by applying a metallizing paste of W and/or Mo onto a green AlN ceramic substrate, flattening, firing and forming the foregoing plating layer or layers. |
申请公布号 |
DE69514435(D1) |
申请公布日期 |
2000.02.17 |
申请号 |
DE1995614435 |
申请日期 |
1995.07.31 |
申请人 |
SUMITOMO ELECTRIC INDUSTRIES, LTD. |
发明人 |
SHIMODA, KOUHEI;NAKATA, HIROHIKO |
分类号 |
C04B41/90;C04B41/52;C04B41/89;H01L23/13;(IPC1-7):C04B41/90 |
主分类号 |
C04B41/90 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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