发明名称 Metallisiertes Keramiksubstrat mit glatter Plattierungsschicht und Herstellungsverfahren
摘要 A metallized ceramic substrate having a smooth plating layer, comprising a ceramic substrate comprising aluminum nitride as a main component; a tungsten- and/or molybdenum-based metallized layer formed on at least one face of the ceramic substrate and a nickel-based plating layer which is formed on the metallized layer and has a thickness of not greater than 2 mu m and a surface roughness (Ra) of not greater than 2 mu m. In another aspect, the plating layer may be constituted of a first nickel-based plating layer and a second gold-based plating layer in which the first plating layer and the second plating layer have a thickness of not greater than 2 mu m and a thickness of not greater than 1 mu m, respectively, and the surface roughness (Ra) of the second layer should be 2 mu m or less. These metallized substrates are produced by applying a metallizing paste of W and/or Mo onto a green AlN ceramic substrate, flattening, firing and forming the foregoing plating layer or layers.
申请公布号 DE69514435(D1) 申请公布日期 2000.02.17
申请号 DE1995614435 申请日期 1995.07.31
申请人 SUMITOMO ELECTRIC INDUSTRIES, LTD. 发明人 SHIMODA, KOUHEI;NAKATA, HIROHIKO
分类号 C04B41/90;C04B41/52;C04B41/89;H01L23/13;(IPC1-7):C04B41/90 主分类号 C04B41/90
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