| 摘要 |
<p>The arrangement involves covering the conductive tracks or buses. This covering is arranged in the form of conductive strips and/or flat elements at a spacing of approx. 1.5 mm. The covering covers both sides of the bus. The respective component groups are connected at least at their corner points or their side edges, ti the GND system. Preferably the covering is provided as SMD components using surface mounting technology or using plug assembly the covers have pin type GND terminals. The covers may be formed as bridges made of several rectangular thin metal plates.</p> |
