发明名称 ESRF CHAMBER COOLING SYSTEM AND PROCESS
摘要 A method and system for cooling an electrostatically shielded radio frequency (ESRF) plasma source (100). The method and system utilize an electrostatic shield (300, 360), having plural ribs (303, 330), which vaporizes a coolant and sprays the vapor against a process tube (400) or a bias shield (300, 360). The vapor is either sprayed underneath the ribs or between adjacent ribs. This design avoids using baths of liquid coolants that can absorb gases which lead to arcing between induction coils.
申请公布号 WO0008229(A1) 申请公布日期 2000.02.17
申请号 WO1999US17516 申请日期 1999.08.03
申请人 TOKYO ELECTRON LIMITED;JOHNSON, WAYNE, L. 发明人 JOHNSON, WAYNE, L.
分类号 H05H1/46;B01J19/08;C23C16/50;H01J37/32;H01L21/00;(IPC1-7):C23C16/00 主分类号 H05H1/46
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