发明名称 HEATING DEVICE FOR MOLDING CARRIER TAPE
摘要 PROBLEM TO BE SOLVED: To avoid lower quality even if a flange between adjacent embossed parts is small by providing a plurality of openings corresponding to the size of the embossed parts in a thermal shield plate, and also providing an opening for adjustment having a larger width in the forwarding direction than the openings between the openings. SOLUTION: A plurality of openings 15 and an opening for adjustment 16 are provided in a thermal shield plate 12, wherein the openings 15 are sequentially provided in the size corresponding to the size of the embossed parts of a carrier tape, while the opening for adjustment 16 is formed with a larger width in the forwarding direction than the openings 15. This structure where the opening for adjustment 16 has the larger width than the openings 15 adjusts the position of a part to be a flange between the embossed parts of a material sheet in the forwarding direction through the opening for adjustment 16, so as to be in the openings 15. Further, softening by thermal radiation and forming the embossed parts by a press mold as it is prevent blushing and a crack in the bent portion of the embossed part.
申请公布号 JP2000037774(A) 申请公布日期 2000.02.08
申请号 JP19980209496 申请日期 1998.07.24
申请人 SHIN ETSU POLYMER CO LTD 发明人 MIYAUCHI TSUTOMU
分类号 B65B15/04;B29C51/42;B29C59/02;(IPC1-7):B29C59/02 主分类号 B65B15/04
代理机构 代理人
主权项
地址