发明名称 CHIP PART
摘要 PROBLEM TO BE SOLVED: To provide a chip part suitable for chip mounting corresponding to a bulk which can be easily manufactured, whose design flexibility can be made high, and whose manufacturing costs can be reduced. SOLUTION: This chip part is provided with a cylindrical element 21 constituted of a ceramic insulator forming coating being a circuit element, rectangular plate-shaped or rectangular column-shaped electrodes 25 connected and fixed to the both edge faces of the cylindrical element 21, and protecting film 26 coating a circuit element part 23 arranged on the outer peripheral face of the cylindrical element between the electrodes 25.
申请公布号 JP2000040621(A) 申请公布日期 2000.02.08
申请号 JP19980222296 申请日期 1998.07.22
申请人 KOA CORP 发明人 MURAKAMI HIDEYUKI
分类号 H01C7/00;H01F17/00;H01F27/02;H01F27/29;H01F41/12;(IPC1-7):H01F17/00 主分类号 H01C7/00
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