| 发明名称 |
Semiconductor device having metal foil integral with sealing resin |
| 摘要 |
A semiconductor device with a metal foil and a sealing resin material. Metal foil is formed integrally with the sealing resin layer.
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| 申请公布号 |
US6023096(A) |
申请公布日期 |
2000.02.08 |
| 申请号 |
US19980032758 |
申请日期 |
1998.02.27 |
| 申请人 |
NITTO DENKO CORPORATION |
发明人 |
HOTTA, YUJI;MOCHIZUKI, AMANE;SAKAMOTO, MICHIE;YOSHIOKA, MASAHIRO |
| 分类号 |
H01L21/60;H01L23/12;H01L23/29;H01L23/31;H01L23/498;H01L23/58;(IPC1-7):H01L23/08;H01L23/10;H01L23/14 |
主分类号 |
H01L21/60 |
| 代理机构 |
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代理人 |
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