发明名称 CONVERSION MODULE
摘要 <p>PROBLEM TO BE SOLVED: To provide a conversion module having structure to relatively easily allow shunting connection without accompanying cost-up, and excellent in connection reliability. SOLUTION: A conversion board 3 mounted with a socket board 4 is provided with a signal sensing element 9, and plural plated through-holes 5, 5A, 5B. At least one portion out of the plural through-holes 5, 5A, 5B is a non- conductive through-hole 5B which is not concerned in conduction. An I/O pin 24B inserted into one end side of the through-hole 5B is connected electrically with a specific I/O pin 24A requiring shunting connection via a conductor pattern 38 of a sub-board 31. The other end side of the through-hole 5B is connected electrically with an input side of the signal sensing element 9 via conductor portions 14, 15, 8a located in a position different from the through-hole 5B.</p>
申请公布号 JP2000040568(A) 申请公布日期 2000.02.08
申请号 JP19980205445 申请日期 1998.07.21
申请人 IBIDEN CO LTD 发明人 NAGAYA KUNIO
分类号 G06F1/18;H01L23/32;H01R33/76;H01R33/94;H05K1/14;(IPC1-7):H01R33/76 主分类号 G06F1/18
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