| 摘要 |
PROBLEM TO BE SOLVED: To enable a chip aggregate to be pelletized satisfactorily into chips in dicing step, by preventing auto-alignment marks for dicing from being concealed. SOLUTION: A semiconductor device has a structure, where a bump 10 or a gold ball is provided onto the electrode 2 of a semiconductor chip formed on a board 1, and the surface of the semiconductor chip is covered with a transparent of semitransparent resin protective film 11 or a molding resin. In this case, the bump 10 or the gold ball is exposed to the surface of the resin protective film 11 or to the surface of the molding resin. |
