发明名称 |
ANISOTROPIC CONDUCTIVE ADHESIVE FILM |
摘要 |
PROBLEM TO BE SOLVED: To provide an anisotropic conductive adhesive film capable of reducing internal stress in thermo-compression bonding. SOLUTION: An anisotropic conductive adhesive film 1 is formed by dispersing conductive particles 7 in insulative adhesive resin 6. A difference between the linear expansion coefficient of the insulative adhesive resin 6 and the linear expansion coefficient of a coated object having a less linear expansion coefficient is not more than 35×10-6.K-1. In the insulative adhesive resin 6 20-70 wt.% of inorganic particles 9 are mixed. In the insulative adhesive resin 6 1-20 wt.% of elastic rubber particles 8 are dispersed.
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申请公布号 |
JP2000040418(A) |
申请公布日期 |
2000.02.08 |
申请号 |
JP19980206000 |
申请日期 |
1998.07.22 |
申请人 |
SONY CHEM CORP |
发明人 |
TAKECHI MOTOHIDE;SAITO MASAO;AKUTSU YASUSHI |
分类号 |
C09J7/02;C09J7/00;C09J9/02;C09J11/00;C09J163/00;C09J171/10;H01B1/20;H01B5/16;(IPC1-7):H01B1/20 |
主分类号 |
C09J7/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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