发明名称 ANISOTROPIC CONDUCTIVE ADHESIVE FILM
摘要 PROBLEM TO BE SOLVED: To provide an anisotropic conductive adhesive film capable of reducing internal stress in thermo-compression bonding. SOLUTION: An anisotropic conductive adhesive film 1 is formed by dispersing conductive particles 7 in insulative adhesive resin 6. A difference between the linear expansion coefficient of the insulative adhesive resin 6 and the linear expansion coefficient of a coated object having a less linear expansion coefficient is not more than 35×10-6.K-1. In the insulative adhesive resin 6 20-70 wt.% of inorganic particles 9 are mixed. In the insulative adhesive resin 6 1-20 wt.% of elastic rubber particles 8 are dispersed.
申请公布号 JP2000040418(A) 申请公布日期 2000.02.08
申请号 JP19980206000 申请日期 1998.07.22
申请人 SONY CHEM CORP 发明人 TAKECHI MOTOHIDE;SAITO MASAO;AKUTSU YASUSHI
分类号 C09J7/02;C09J7/00;C09J9/02;C09J11/00;C09J163/00;C09J171/10;H01B1/20;H01B5/16;(IPC1-7):H01B1/20 主分类号 C09J7/02
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