发明名称 |
Transmission circuit using strip line in three dimensions |
摘要 |
There is provided a transmission circuit using a strip line which can be formed in three dimensions with simple construction and low cost and which has high reliability. A first microstrip line is formed by sandwiching a dielectric substrate 1 between a first strip conductor 2 provided on a top surface of the dielectric substrate 1 and a first grounding conductor 3 provided on a bottom surface of the dielectric substrate 1. A second microstrip line is formed by sandwiching the dielectric substrate 1 between a second strip conductor 4 provided on the bottom surface of the dielectric substrate 1 and a second grounding conductor 5 provided on the top surface of the dielectric substrate 1. The first strip conductor 2 and the second strip conductor 4 are electrically connected to each other by a connecting through hole 11 provided in the dielectric substrate 1.
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申请公布号 |
US6023211(A) |
申请公布日期 |
2000.02.08 |
申请号 |
US19970986306 |
申请日期 |
1997.12.05 |
申请人 |
SHARP KABUSHIKI KAISHA |
发明人 |
SOMEI, JUNICHI |
分类号 |
H01P3/08;H01P5/02;H01P5/08;H05K1/02;H05K3/42;(IPC1-7):H01P3/08;H05K1/11 |
主分类号 |
H01P3/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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