| 摘要 |
PROBLEM TO BE SOLVED: To obtain a composition which can form a film improved in adhesion, uniformity, dielectric properties, etc., by incorporating a hydrolyzate of a specified compound and/or a partial condensate thereof, a metal chelate compound, and an organic solvent. SOLUTION: This composition is prepared by mixing 100 pts.wt. hydrolyzate obtained by adding 0.3-1.2 mol, per mol of the R2O groups, of water to a compound (A) of the formula: R1nSi(OR2)4-n and/or partial condensate thereof having a weight-average molecular weight of 500-100,000 (in terms of the polystyrene) with 0.5-300 mmol, desirably, 0.5-2000 mmol of a metal chelate compound (B) of the formula: R3tM(OR4)4-t, 5-75 wt.% (based on component A) compound (C) which is capable of being compatibilized with or dispersed in component A and having a boiling point of a decomposition temperature of 250-450 deg.C, and an organic solvent having a boiling point of 250 deg.C or below and used in an amount 0.3-25 times the total weight of components A to C. In the formulae, R1, R2, and R4 are each a monovalent organic group; n is 0-2; R3 is a chelating agent; M is at least one metal selected among Ti, Zr, Al, Sn, Sb, Nb, Ta, and Pb; and (t) is 1-4.
|
