发明名称 |
METALLIC PLATE CONNECTING STRUCTURE WITH SUBSTRATE IN MOLDED PARTICLE AND METHOD FOR CONNECTING THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To provide a metallic plate connecting structure with a substrate in a molded particle in which manufacture can be easily attained, and any connection failure between a conductive pattern and a metallic plate cannot be generated, and a method for connecting this. SOLUTION: A terminal connection pattern 17 made of a conductive pattern constituted of elastic conductive paint is formed on a flexible substrate 10, a metallic plate 20 is placed on the terminal connection pattern 17, and a molded particle 30 is molded so that the connected part of the terminal connection pattern 17 with the metallic plate 20 can be covered. Thus, the terminal connection pattern 17 of the flexile substrate 10 and the metallic plate 20 can be fixed in a connected state with elasticity. |
申请公布号 |
JP2000040607(A) |
申请公布日期 |
2000.02.08 |
申请号 |
JP19980207922 |
申请日期 |
1998.07.23 |
申请人 |
TEIKOKU TSUSHIN KOGYO CO LTD |
发明人 |
INAGAKI JIRO;HIRAHARA SHINJI |
分类号 |
H01C17/28;H01F1/059;(IPC1-7):H01C17/28;H01R12/32 |
主分类号 |
H01C17/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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