发明名称 |
Packaged surface acoustic wave filter chips utilizing an on-chip relay terminal |
摘要 |
A surface acoustic wave device includes a plurality of surface acoustic wave filter chips having external connection terminals and a package accommodating the plural surface acoustic wave filter chips. The package is provided with a plurality of terminals for connection with the surface acoustic wave filter chips, and one of the external connection terminals of a first one of the surface acoustic wave filter chips is connected with one of the terminals of the package via a second one of the surface acoustic wave filter chips.
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申请公布号 |
US6023204(A) |
申请公布日期 |
2000.02.08 |
申请号 |
US19980153335 |
申请日期 |
1998.09.15 |
申请人 |
FUJITSU LIMITED |
发明人 |
IKATA, OSAMU;SATOH, YOSHIO;MATSUDA, TAKASHI;TSUTSUMI, JUN;MIYAMOTO, SATOSHI |
分类号 |
H03H9/25;H03H9/05;H03H9/64;(IPC1-7):H03H9/64;H03H9/10 |
主分类号 |
H03H9/25 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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