SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device where the circuit formation surface of a semiconductor element is sealed up with resin and a manufacturing method thereof, wherein cracking is restrained from occurring in the semiconductor device to improve it in reliability. SOLUTION: A semiconductor device 20A is equipped with a semiconductor element 25, a board 25 where the semiconductor element 25 is mounted, and a sealing resin 27A that seals up a circuit formation surface 23 provided to a semiconductor element 22A. The sealing resin 27A is composed of a circuit surface sealing part 28A that seals up the circuit formation surface 23, and a side covering part 29A that is provided integrally with the sealing resin 27A and covers the peripheral side 22a of the semiconductor element 22A. If the height of the semiconductor element 22A is represented by T and the height of the side covering part 29A from the circuit formation surface 23 is represented by t, T and t are so constituted as to satisfy T/4<=t<=T.