发明名称 SEMICONDUCTOR HEAT TREATMENT DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor heat treatment device with which the temperature of heat treatment can be constantly maintained both in heightwise direction and horizontal direction of a reaction tube. SOLUTION: A quartz jig 70, where a plurality of wafers are mounted, is provided inside a reaction tube 10, the inside of the reaction tube is heated up by a heater device 20 containing a plurality of heaters arranged on the circumference of the reaction tube. A temperature control part feeds power through heater terminals 21 to 25 corresponding to heaters having different mounting heights. The circumferential part 20a of the heater terminals of each heater is separated from other part 20b, and power can be fed individually to each part of the separated heater. The temperature control part feeds power individually to each part of the separated heaters, and the above-mentioned power can be controlled in such a manner that the temperature inside the reaction tube becomes constant in heightwise direction and horizontal direction.
申请公布号 JP2000040666(A) 申请公布日期 2000.02.08
申请号 JP19980206475 申请日期 1998.07.22
申请人 KOKUSAI ELECTRIC CO LTD 发明人 FURUNO MAKOTO
分类号 H01L21/22;H01L21/324;(IPC1-7):H01L21/22 主分类号 H01L21/22
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