发明名称 |
Method for using photoabsorptive coatings and consumable copper to control exit via redeposit as well as diameter variance |
摘要 |
A method of forming a through-via in a laminated substrate by applying a polymeric photo-absorptive layer on an exposed bottom surface of a laminated substrate. A through-via is laser drilled in the substrate from a top of the substrate through the substrate to a bottom of the substrate. The photo-absorptive layer formed on the bottom surface of the substrate is then removed.
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申请公布号 |
US6023041(A) |
申请公布日期 |
2000.02.08 |
申请号 |
US19960747095 |
申请日期 |
1996.11.08 |
申请人 |
W.L. GORE & ASSOCIATES, INC. |
发明人 |
NODDIN, DAVID B. |
分类号 |
H01L21/48;H01L23/12;H01L23/538;H05K3/00;H05K3/42;H05K3/46;(IPC1-7):B23K26/00 |
主分类号 |
H01L21/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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