| 摘要 |
PROBLEM TO BE SOLVED: To provide a bond for temporary fixing which can materialize the secure soldering without hindering self alignment. SOLUTION: A main agent, a hardener, and an additive are mixed, and at least one kind among hydrofined castor oil, fatty acid amide wax, organic bentonite, gelatin, benzoaldehyde condensed matter, and cellulose is included in the additive to make a bond 7 for temporary fixing. According to this bond 7 for temporary fixing, solder 3 fuses before this bond 7 for temporary fixing, and self alignment arises without fail, and after finish of correction of electronic parts, this bond 7 for temporary fixing hardens, and the temporary adhesion of the electronic parts is performed.
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