发明名称 Method of cleaving a brittle material using a point heat source for providing a thermal stress
摘要 A method of cleaving a strip by tensile stress applied by a pulse laser point heat source by shifting a pulse-heating position of the pulse laser point heat source on the basis of both an optimum distance "D" of a center position of a pulse beam spot of the pulse laser point heat source irradiated on the strip from a tip of a crack of the strip and an optimum pulse time "t" of the pulse laser point heat source, wherein the optimum distance "D" is determined by the steps of: selecting "t" to find a value of 4 kappa t/W2 where " kappa " is a thermal diffusivity of the strip, "W" is a width defined as a distance between a cleaving-intended line and a side edge of the strip; and finding an optimum value of D/W from the value of 4 kappa t/W2 with reference to a previously obtained relationship between the optimum value of D/W and the value of 4 kappa t/W2 thereby to find the optimum distance "D". The optimum distance "D" is found so that if the value of 4 kappa t/W2 is in the range of 0.0001-0.05, then the optimum value of D/W is 0.1, if the value of 4 kappa t/W2 is in the range of 0.05-1.0, then the optimum value of D/W is 0.2, and if the value of 4 kappa t/W2 is not less than 1.0, then the optimum value of D/W is 0.4.
申请公布号 US6023039(A) 申请公布日期 2000.02.08
申请号 US19970960043 申请日期 1997.10.29
申请人 NEC CORPORATION 发明人 SAWADA, HIROSHI
分类号 B23K26/00;B23K26/40;C03B33/09;H01L21/301;(IPC1-7):B23K26/00 主分类号 B23K26/00
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