发明名称 SURFACE-MOUNTING ELECTRONIC COMPONENT AND MANUFACTURE THEREOF
摘要 PROBLEM TO BE SOLVED: To enable a surface-mounting part to be reduced in size and thickness and improved in profitability, and its electrode to be improved in reliability. SOLUTION: A circuit part 2 is mounted on the one side of a board 1. The mounting surface of the board 1 is covered with molding resin 3, together with the circuit part 2. Terminal electrodes 9 are provided in the peripheral part of the board 1. The terminal electrodes 9 of the board 1 are formed in a manner, where a conductive material 10 filled up in through-holes 6 provided in the board 1 is cut off together with the molding resin 3, that covers the entire one side of the board 1.
申请公布号 JP2000040768(A) 申请公布日期 2000.02.08
申请号 JP19980207453 申请日期 1998.07.23
申请人 TDK CORP 发明人 KOBAYASHI KAZUMI;AKACHI YOSHIAKI;TAKAHASHI MASAMI;OZAKI YUMIKO
分类号 H01L23/12;H01L21/56;(IPC1-7):H01L23/12 主分类号 H01L23/12
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