| 摘要 |
PROBLEM TO BE SOLVED: To secure a film thickness required for compression bonding by preventing the degradation of the film thickness due to the influence of heat and pressure in transferring an anisotropic conductive film. SOLUTION: This anisotropic conductive film 1 is composed by mixing, in a binder resin 2, conductive particles 3 and insulating particles 4 each of which has a particle diameter larger than that of the conductive particles 3 and with which the elasticity lowering temperature is low. The particle diameter of each of the insulating particles 4 is around 0.7-1 time as much as the film thickness of the anisotropic conductive film 1. The glass transition point of the insulating particles 4 is smaller than that of the conductive particles 3. The film thickness not less than the particle diameter of each of the insulating particles 4 can be retained after transferring, and the film thickness required for compression bonding can be secured. In addition, the insulating particles 4 are easily flattened when compression-bonded, electrodes are electrically connected by the conductive particles 3. Additionally, the insulating particles 4 reside between electrodes adjacent to each other, so that a short circuit caused by the communication of the conductive particles 3 can be prevented. An electrode connection structure having high electrical connection reliability can also be provided. |
