| 摘要 |
PROBLEM TO BE SOLVED: To uniformly apply plating to the whole body of the surface excluding the point contacts of a ball, to increase the area to be applied with plating and to obtain a plated ball of stable quality by holding a bearing ball at point contacts by magnetic force, dipping it into a plating bath and applying electroplating thereon. SOLUTION: A holding means 21 is elevated, and a ball 41 is held to the tips of three pins 23 taken up from a plating soln. 12. Magnetic force is acted on the pins 23 by a magnetic force imparting means 24, the ball 41 is attached on the tips of the pins 23, the point contact parts 23a of the three pins 23 are point-contacted to the three points on the surface of the ball 41. The holding means 21 is lowered, and the ball 41 is dipped into the plating soln. 12. When the electric current is made to flow from a power source 31, lead ions penetrated from a lead case 13 as the anode adhere to the surface of the ball 41 as the cathode and the surface of the ball 41 is applied with lead plating. After the completion of the plating, the holding means 21 is elevated, and the ball 41 is detached from the tips of the pins 23.
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