| 摘要 |
<p>PROBLEM TO BE SOLVED: To form a microscopic multilayer wiring by a method, wherein a wiring part is formed by plating using a transfer block, and, after providing an electrodeposited bonding agent layer on the wiring part, a wiring layer consisting of the wiring part and the electrodeposited bonding agent layer is formed through the electrodeposited bonding agent layer. SOLUTION: When a wiring substrate is formed, first, conductive layers 120 and 125 to be used for formation of an external terminal part 127 are provided on a first surface 110A, and through-holes 115 are formed on the prescribed part. Then, one or more layers of wiring layers, whereon an adhesive material layer 140 and a wiring part 150 are provided, are formed on the second surface 110B of the insulating layer 110, using a transfer block in such a manner that at least the upper layers do not come closer to the through-holes 115 than the lower layers in the vicinity of the through-holes 115. A conductive layer 170 is provided using a lift-off method, then an external terminal 127 is formed by etching the conductive layers 120 and 125 of the first surface 110A. As a result, a multilayered wiring on the side of the second surface 110B can be formed in a microscopic manner.</p> |
