| 摘要 |
PROBLEM TO BE SOLVED: To obtain a plated metallic film or a plated electrode on an inorganic substrate, which has excellent adherability to a inorganic substrate, by supplying a positive voltage to a metallic film plated on the inorganic substrate and supplying negative voltage to the inorganic substrate so as to generate a static attractive force at the interface between the metal film and the inorganic substrate. SOLUTION: A plated metallic film 2 of a metal such as Ni, Co, Cu, Zn, Cr or Fe or an alloy thereof is formed on an inorganic substrate 1 and then a negative voltage is applied to the inorganic substrate through an electrode 3 for supplying negative voltages and a positive voltage is supplied to the metallic film 2 plated on the inorganic substrate so as to generate static attractive force at the interface between the inorganic substrate 1 and the metallic film 2. There is no metal oxide at the interface between the inorganic substrate 1 and the metallic film 2 because the metallic film 2 is a metallic film plated on the inorganic substrate 1, thereby a sufficient adhesive force can be obtained by giving an accumulated charge of about 1/10,000-1/10 of the charge given in the anodic jointing method. By this method, it is possible to reduce the temp. of pre-heating or the temp. during jointing process, to shorten the cooling time after jointing and to improve the throughput.
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