INTEGRATED CIRCUIT PACKAGE LEAD TESTING APPARATUS AND METHOD

摘要

PURPOSE: An integrated circuit package lead testing apparatus is provided to test leads of an integrated circuit package exactly. CONSTITUTION: The integrated circuit package lead testing apparatus comprises:a rail(251), wherein an integrated circuit package(271) is transferred on the rail; a stop device(227) for stopping the integrated circuit package on the rail; a guard cover(261) for blocking top and both sides of the rail in order for the package not to go out from the rail; a camera for checking an external appearance of leads of the package; a first control device(225) installed at one side of the rail, for closely sticking the integrated circuit package to the guard cover at the other side of the rail; a second control device(325) installed at the other side of the rail, for closely sticking the integrated circuit package to a guard cover at the one side of the rail.