FINE PITCH BALL GRID ARRAY

摘要

PURPOSE: A fine pitch PGA(ball grid array) is provided to improve a reliability and reduce manufacturing cost by molding a rear surface of a substrate except for a ball mounting region. CONSTITUTION: The PGA comprises a substrate(20) made of insulating film or tape carrier and having an upper surface exposed of a wire bonding region of conducting patterns(23) and a rear surface exposed of conductive ball mounting region; an edge pad chip(10) having bonding pads(11) attached on the substrate(20); a bonding wire(30) connected between the boding pads(11) of the edge pad chip(10) and the wire bonding region; a molding epoxy(40) for molding the edge pad chip(10), the bonding wire(30) and wire bonding region except for the conductive ball mounting region on the rear surface of the substrate(20); and a conductive ball(50) mounted on the conductive ball mounting region.