| 摘要 |
PURPOSE: A spin scrubber apparatus is provided to remove foreign material on a wafer or flatten a surface of the wafer. CONSTITUTION: The apparatus comprises a wafer supporter(100) upon which a wafer(108) is placed; a deionized wafer injector(102) injecting a deionized wafer; a brush(106) for removing particles on the wafer(108) or flattening a surface of the wafer(108); a brush supporter(104); and an auto spacing setting device(110) automatically controlling a spacing between the wafer(108) and the brush(106). An electric circuit unit, automatically controlling the spacing, is mounted between the brush supporter(104) and the wafer supporter(100). The spacing is controlled by a capacitance value between the wafer supporter(100) and the electric circuit unit.
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