发明名称 |
PRINTED CIRCUIT MULTILAYER BOARD |
摘要 |
PURPOSE: A printed circuit multilayer board is provided to be able to form an outer circuit easily to the upper area of the through- hole formed in the inner layer of the printed circuit multilayer board, by means of laser hole processing. CONSTITUTION: The printed circuit multilayer board comprises; an inner layer circuit(110) on up and down the board(100); an insulation layer(130) spread on upper and lower area of the inner circuit(110) to insulate it; a perforated hole(140) on the board(100) on which an insulating layer(130) is spread; an electrolysis plating layer(150) formed inner side of the perforated hole; a non-conductive resin charger(160) charged in the perforated hole(140) of the board(100).
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申请公布号 |
KR20000008501(A) |
申请公布日期 |
2000.02.07 |
申请号 |
KR19980028336 |
申请日期 |
1998.07.14 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
SONG, CHANG KYU;KIM, SANG JIN;KWON, OH KUN |
分类号 |
H05K3/46;(IPC1-7):H05K3/46 |
主分类号 |
H05K3/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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