| 摘要 |
PURPOSE: The socket is provided to improve properties of connecting part between a semiconductor device and an inspection device electrically to improve reliability. CONSTITUTION: In socket by which a test board(B) is connected electrically with a semiconductor device having a various lead(L1, L2) array, includes; a socket(31) formed in structure divided upward and downward, combined with a rivet(35), and having thru holes with an expanding hole part; an upper head(32) formed at the upper side on the thru hole of the socket(31), and having flange(32a) for prevent separation; and a two-step spring(34) formed at the lower side on the thru hole of the socket(31), having a reduced diameter for preventing separation.
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