发明名称
摘要 <p>A motor control circuit for a wire bonding apparatus for manufacturing semiconductor devices, etc. using a feedback gain circuit which performs feedback control of a synthesized signal that drives a Z-axis motor for moving a capillary up and down. The gain value of the feedback gain circuit is controlled by a computer, thus allowing smooth and stable control of the motor operation even after rotational speed change of the Z-axis motor, and assuring a stable wire bonding.</p>
申请公布号 JP3005781(B2) 申请公布日期 2000.02.07
申请号 JP19920227974 申请日期 1992.08.04
申请人 发明人
分类号 H01L21/60;B23K20/00;(IPC1-7):H01L21/60 主分类号 H01L21/60
代理机构 代理人
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