| 摘要 |
PURPOSE: A module PCB having a selective pad is provided to be able to reduce the cost according to the improvement, the production, the management of the module PCB separately, and to be able to improve the efficiency of the module assembly process. CONSTITUTION: The module PCB has; a mount area(120), the area corresponding to semiconductor devices(110); a circuit wiring to electrically contact pins of the semiconductor devices(110) corresponding to the mount area(120) with a contact terminal(130) of a module PCB; a selecting terminal(160) to be able to contact a 21th pin(114) of the semiconductor device with the corresponded terminal(134,134') according to the kind of the semiconductor device(110).
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