发明名称 |
ANNEALING APPARATUS OF SEMICONDUCTOR WAFER HAVING SIDE HEATING RAMP |
摘要 |
PURPOSE: A semiconductor wafer annealing apparatus is provided to improve a uniformity of heat treatment of the wafer by heating sides of wafer using a side heating ramp. CONSTITUTION: The annealing apparatus comprises an upper heating ramp(4) for heating an upper surface of a wafer(2) loaded in an annealing chamber(1) by irradiating lights; and a side heating ramp(5) for heating both sides of the wafer(2) by irradiating lights. The wafer(2) is horizontally rotating by a spinner(3). The side heating ramp(5) is made of a pair of halogen ramp. The upper heating ramp(4) includes a plurality of unit ramps(6).
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申请公布号 |
KR20000008055(A) |
申请公布日期 |
2000.02.07 |
申请号 |
KR19980027701 |
申请日期 |
1998.07.09 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
CHANG, DAE GEUN;MUN, SOO MIN;LEE, YONG WI;HONG, SANG GYUN |
分类号 |
H01L21/324;(IPC1-7):H01L21/324 |
主分类号 |
H01L21/324 |
代理机构 |
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代理人 |
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地址 |
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