SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE HAVING CAPACITOR FORMED UNDER BONDING PAD

摘要

PURPOSE: A semiconductor integrated circuit device is provided to reduce a chip area by forming a high capacitance capacitor or a plurality of a low capacitance capacitors and arranging power supply and ground rails under bonding pads. CONSTITUTION: The device comprises a semiconductor substrate having a main surface; a region having a plurality of bonding pads formed on the main surface; a first wiring layer arranged between the main surface and the pads and extended along the region; a second wiring layer, arranged between the main surface and the first wiring layer and along the region; and an insulating layer formed between the first and the second wiring layers and contacted with the layers.