HOLDER ASSEMBLY FOR RELEASING A SEMICONDUCTOR CHIP FROM A WAFER

摘要

PURPOSE: A holder assembly applicable for releasing various kinds of semiconductor chips from a wafer in a die bonding device is provided. CONSTITUTION: The holder assembly according to the present invention comprises a plurality of plunger pins(21) which are brought into contact with a bottom surface of a certain semiconductor chip of a wafer; a plunger pin holder(22) having pin fixing holes(28) for receiving the plunger pins(21); and a holder cover(23) for receiving the plunger pin holder(22) which has pin inserting holes(31,32) and a plurality of suction ports(34) for applying suction pressure. The pin fixing holes(28) are radially arranged. The pin inserting holes(31,32) are formed at positions which are correspond to the positions of the pin fixing holes(28). The pin fixing holes(28) are formed at certain positions adapted to disperse the weight of the semiconductor chip.