METHOD OF FORMING VIA CONTACT OF ANCHOR SHAPE

摘要

PURPOSE: A method of forming via contact is provided to prevent lifting of contact plug caused by the process of CMP or cleaning. CONSTITUTION: The method of forming via contact comprises the steps of forming conduction line layer on a wafer, forming barrier layer on the conduction line layer, forming conduction line and barrier line pattern by patterning, forming inter metal dielectric layer to cover the wafer including the conduction line and barrier line, forming via hole revealing a part of the barrier line pattern by an isotrophic etching and forming anchor hole extended to the inner part of the revealed barrier line pattern to form a wider pattern by isotrophic etching to the revealed barrier line pattern.