| 摘要 |
PURPOSE: An arc/plasma deposition apparatus is provided to solve the problems of limited working pressure, destruction of target protector, and limitation of the size of object. CONSTITUTION: The arc/plasma deposition apparatus comprises a negative pole part(1) including an insulator member positioned at the top of the apparatus, a cathode member positioned below the insulator member and having a magnetron, a cooling line for supplying cooling water to the cathode member, a power line for supplying electric power to the magnetron, the cooling and power lines piercing the insulator part, a target hold for holding a target, and a target protector; a ring-shaped positive pole part(2) positioned below the negative pole part, able to adjust a distance from the target and having a large centric hole and multiple screw holes placed around the centric hole; and a deposition chamber(3) including a wafer support for supporting a wafer and a support height adjustor for adjusting the height of the wafer support, the support height adjustor installing on the bottom of the chamber.
|
