| 摘要 |
PROBLEM TO BE SOLVED: To give compatibility to CSP pins by a method, wherein even number pins are arranged one by one from the lower side on the first row of the left side pad region, odd number pins are arranged one by one on the second row, and the even number pins are arranged one by one on the upper side of the first row of the right side pad region. SOLUTION: The first row of a left side pad 7 of a chip size package(CSP) is provided with even numbered pins of a thin type small outline package(TSOP) arranged one by one beginning with smaller number, and the second row is provided with the odd number pins arranged one by one in the order of from smaller numbers. Also, the first row of the right side pad 8 of the CSP is provided with large odd number pins arranged one by one, and the second row is provided starting from large number pins of the TSOP arranged one by one. As a result, VSSQ pins are located outside, DQ pins 10 and 14 are located inside, and the passage of two wires between balls can be prevented. Accordingly, the die pad of thin pin arrangement structure is applicable to either of the TSOP and the CSP. |
