| 摘要 |
PROBLEM TO BE SOLVED: To enable a semiconductor manufacturing device to be easily maintained without increasing it in size, when substrates are delivered to the semiconductor manufacturing device from outside as they are kept being housed in a cassette housing box. SOLUTION: A cassette 6, where wafers (kept in horizontal position) are housed, is loaded into a cassette housing box 2, and the cassette housing box 2 is delivered into a main body housing 1 and placed on a delivery section 3. The cassette 6 is taken out from the cassette housing box 2 by a cassette unloading mechanism 7 located under the delivery section 3. The cassette 6, taken out from the cassette housing box 2, is transferred above the delivery section 3 by a cassette loader 9, and the orientation flats and notch matching of the wafers 5 inside the cassette 6 are aligned by a cassette position conversion mechanism 11 and an orientation flat/notch alignment mechanism 12. A cassette temporary shelf 13, where the cassettes 6 which house the wafers 5 that are kept on standby for an orientation flat or notch alignment, is placed is provided above the delivery section 3. |
