| 摘要 |
PROBLEM TO BE SOLVED: To obtain a method and an apparatus for manufacturing a thermosetting resin molded product and its mold assembly wherein a cycle time of a resin sealing process is shortened, and a production capacity of the sealing process can be improved. SOLUTION: Molds 1, 2 wherein resin molding part 5a to 5d (5) in which a fluid state thermosetting resin is cast and molded, and resin curing part 6a to 6b (6) in which a curing reaction of the thermosetting resin is completed are formed by being adjacent to each other, are used. A semiconductor element 4 is cast into the resin molding part 5 in a state wherein the molds 1, 2 are open. A semicured sealing body 9a in the resin molding part 5 is transferred to the resin curing part 6. A resin sealing body 9b having completed curing in the resin curing part 6 is taken out, and a resin is molded onto the semiconductor element 4 cast into the resin molding part 5. Then, curing of the semicured sealing body 9a cast into the resin curing part 6, is completed. |
