METHOD FOR MANUFACTURING FLIP CHIP BGA PACKAGE

摘要

PURPOSE: A flip chip BGA(ball grid array) package fabrication method is provided to simplify the manufacturing process. CONSTITUTION: The method comprises the steps of forming an electrode pad(12) on a chip(11); coating a passivation layer(13) to partially expose the electrode pad(12); performing activation treatment the exposed portion of the electrode pad(12) so as to easily plate; forming a bump(15) by electroless plating Ni or Cu to the activating portion of the electrode pad(12); forming a contact pad(22) in a substrate(21); soldering the contact pad(22); coating a flux(25) to the soldered contact pad; contacting the bump(15) and the contact pad(22); molding an epoxy(26) to the space between the chip(11) and the substrate(21) contacted by the bump and the contact pad; and forming a solder ball(27) on the resultant structure.